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INTERMOLD Die & Mold Asia Japan Metal Stamping Technorogy Exhibition / AM EPO

NEWS

Dec.24.2024: Year-End Greetings and Notice of New Year Holiday Closure

Aug.01.2024: The application for INTERMOLD/ Die and Mold Asia/ Japan Metal Stamping Techology Exhibition/ AM EXPO 2025 has started.
Visit the link for the show detail.

Jul.01.2024: INTERMOLD/ Die and Mold Asia/ Japan Metal Stamping Technology Exhibition/ AM EXPO will be held on April 16-18, 2025 in Tokyo!
We will return to Osaka and Nagoya in 2026.

Jun.03.2024: Now you can download "FLOOR MAP for Nagoya"

May.10.2024: ＝＝＝
Office relocation announcement
＝＝＝
INTERMOLD office move to the below address after May 13th.
1-1-7, Otemae, Chuo-ku, Osaka 540-0008 Japan
TEL +81-6-6944-9911
Phone & Fax number is not changed.

? INTERMOLD Development Association ALL RIGHTS RESERVED

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