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INTERMOLD Die & Mold Asia Japan Metal Stamping Technorogy Exhibition

ABOUT THE SHOW

JT SPACE株式會社

Exhibitor name
JT SPACE株式會社
JT SPACE Co., Ltd.
Booth NO. 2-111
Address

〒108-0073

東京都

港區三田一丁目2番18號

TTDビル

TTD Bldg,1-2-18,Mita,Minatoku,Tokyo,108-0073 Japan

Website https://www.jtspace.co.jp/
Email
Phone number 07092874870
The name of Item[1] Liquid Cooling Heat Exchanger
Details[1]

Purpose of Use: This is a module for a liquid-cooled heat exchanger. In the AI era, due to the high demand for computation, an excellent cooling solution is crucial for CPU overclocking and stable system operation. The jtSPACE cooling module, with its advanced design and efficient manufacturing, reduces CPU temperature and enhances the performance of AI applications.

Conventional Methods: Three-dimensional special structures were not possible.

Additive Manufacturing: Additive manufacturing enables the realization of integrated special three-dimensional structures, improving conversion efficiency by designing them in conjunction with flow paths.

Size:190(L)× 82 (W)× 40 (H)mm3
The name of Item[2] Heat Sink with cooling fins
Details[2]

Purpose of Use: This is a module with a heatsink equipped with cooling fins. In the AI era, due to the high demand for computation, an excellent cooling solution is crucial for CPU overclocking and stable system operation. The jtSPACE cooling module, with its advanced design and efficient manufacturing, reduces CPU temperature and enhances the performance of AI applications.

Conventional Methods: Three-dimensional special structures were not possible.

Additive Manufacturing: Additive manufacturing enables the realization of integrated special three-dimensional structures, improving conversion efficiency by designing them in conjunction with flow paths.

Size:88 (L) × 88 (W) × 35 (H) mm3
The name of Item[3] Cutaway Light-Weight Impeller (Lattice)
Details[3]

Purpose of Use: The aim is to reduce the weight of the main body and decrease energy consumption.

Conventional Methods: Precision casting or shaping by multi-axis processing of round bars, which cannot be hollowed to achieve weight reduction.

Additive Manufacturing: Allows the production of hollow or embedded structural products, reducing product weight and inertia moments, effectively enhancing performance, and reducing energy consumption.

Size: 100 (L) × 100 (W) × 67 (H) mm3
The name of Item[4] Structurally-optimized honeycomb light-weight structure
Details[4]

Purpose of Use: Achieve weight reduction of the support frame.

Conventional Methods: Normally, structures are lightened by drilling or hollowing out, but this method increases grooves and complicates shapes, leading to increased processing time and costs, and sometimes making processing impossible.

Additive Manufacturing: Enables weight reduction through complex shapes and three-dimensional intersecting designs.

Size: 160 (L) × 60 (W) × 18 (H) mm3
The name of Item[5] Heat Sink with Cooling Fins (Copper)
Details[5]

Purpose of Use: This is a module with a copper heatsink equipped with cooling fins. In the AI era, due to the high demand for computation, an excellent cooling solution is crucial for CPU overclocking and stable system operation. The jtSPACE cooling module, with its advanced design and efficient manufacturing, reduces CPU temperature and enhances the performance of AI applications.

Conventional Methods:Three-dimensional special structures were not possible.

Additive Manufacturing: Additive manufacturing enables the realization of integrated special three-dimensional structures, improving conversion efficiency by designing them in conjunction with flow paths.

Size: 88 (L) × 88 (W) × 35 (H) mm3
The name of Item[6] Special Structure (Copper)
Details[6]

of Use: The polyhedral structure provides applications in heat exchange, reactors, or lightweight uses.
Conventional method: Cannot achieve special three-dimensional structures.
Layered manufacturing: Can achieve integrated special three-dimensional structures. By designing the flow path and combining it with the polyhedral structure, the conversion efficiency can be improved.
Size: 80(L) × 80(W) × 100(H) mm3
The name of Item[7] Hinge Cover
Details[7]

Layered manufacturing is one of the optimal methods for producing consumer electronics components. It offers high precision and flexibility, ensuring product performance. It can accommodate complex geometric structures and customized requirements, shortening the production cycle and improving efficiency. Representative products include smartwatches, mobile device cases, and accessories.
The products exhibited this time are smartphone hinge covers with 800 shafts.
Size: 300(L) × 300(W) × 240(H) mm3
Category of
Exhibit Items

M. PROTOTYPE, MODELING, 3D PRINTING

Metal 3D Additive Manufacturing