株式會社積層金型
| Exhibitor name |
株式會社積層金型
SEKISOU KANAGATA Co.,LTD
|
|---|---|
| Booth NO. | 1-441-60 |
| Address |
〒737-0134 広島県 呉市広多賀谷2-3-12 2-3-12,hirotagaya,kure,hiroshima,737-0134 |
| Website | http://www.sekisou.com |
| Phone number | +81-８-73-4565 |
| PR message | Diffusion bonding is a method for close adherence of the welding base material and pressurization at a temperature lower at than the base material melting point without causing plastic deformation, resulting in bonding by making use of diffusion of the atoms between the bonded surfaces. |
| The Main Item |
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| The name of Item[1] | Diffusion Bonding |
| Details[1] |
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| Category of Exhibit Items |
A. MOLDS, MOLD MATERIALS Molds Mold Materials Mold Components Formed Products |
