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| Exhibitor name |
株式會(huì)社積層金型
SEKISOU KANAGATA
|
|---|---|
| Booth NO. | 3-801 |
| Address |
〒737-0134 広島県 呉市広多賀谷2-3-12 2-3-12,Hirotagaya,Kure,Hiroshima |
| Website | http://www.sekisou.com |
| t-yamasaki@sekisou.com | |
| Phone number | +81-8-823-4565 |
| FAX | +81-8-823-4569 |
| PR message | ?High-cycle Resin Mold Die Diffusion bonding laminated dies and diffusion bonding laminated blocks (Available for selection for processes from waterway design to finishing) The waterway in the die can be set to match the shape, enabling improved cooling performance and reduced molding cycle time |
| The Main Item |
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| Category of Exhibit Items |
A. MOLDS, MOLD MATERIALS Mold Materials Mold Components |
